This UROP project aims at experimentally investigating hybrid silicon photonic microdisk lasers as an energy-efficient, on-chip optical source. The project's key objective is to demonstrate such micrometer-scale laser sources on a silicon photonic chip, with a continuous-wave laser emission in the 1550nm telecommunications wavelength, potentially a low lasing threshold, up to a 25Gb/s direct-modulation data rate, and a direct optical output-coupling to a seamlessly integrated silicon photonic waveguide. Successful demonstration of the objective will lead to a versatile building block for silicon photonic integrated circuits (PICs), which are now showing promises in high-impact technological areas including communications, datacenters, and non-communications applications such as sensing and instrumentation.
*Laser Safety (MC04) self-learning program and an eye exam are mandatory.
1. To design and numerically model hybrid silicon photonic microdisk lasers including their optical, electrical, thermal, and RF characteristics
2. To characterize the fabricated microdisk lasers including their optical, electrical, thermal, and RF characteristics
Applicant's Learning Objectives:
1. To acquire a basic understanding of optics and photonics, particularly integrated photonics
2. To acquire a hands-on experience in numerical modeling of integrated photonic components
3. To acquire a hands-on experience in conducting optics experiments, with emphasis in characterizing integrated photonic components (e.g., microlasers emitting in the near-infrared wavelengths)